Part Details for MC7447AHX733NB by Freescale Semiconductor
Overview of MC7447AHX733NB by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for MC7447AHX733NB
MC7447AHX733NB CAD Models
MC7447AHX733NB Part Data Attributes
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MC7447AHX733NB
Freescale Semiconductor
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Datasheet
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MC7447AHX733NB
Freescale Semiconductor
32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | |
| Pin Count | 360 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | |
| Address Bus Width | 36 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 167 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 360 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA360,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.24 mm | |
| Speed | 733 MHz | |
| Supply Voltage-Max | 1.35 V | |
| Supply Voltage-Min | 1.25 V | |
| Supply Voltage-Nom | 1.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MC7447AHX733NB
This table gives cross-reference parts and alternative options found for MC7447AHX733NB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC7447AHX733NB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MC7447AVU733NB | 32-BIT, 733MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | MC7447AHX733NB vs MC7447AVU733NB |
| PC7447MGU733LB | RISC Microprocessor, 32-Bit, 733MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | MC7447AHX733NB vs PC7447MGU733LB |
| PC7447VGU733LB | RISC Microprocessor, 32-Bit, 733MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Teledyne e2v | MC7447AHX733NB vs PC7447VGU733LB |
| PCX7447MGU733LB | RISC Microprocessor, 32-Bit, 733MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | MC7447AHX733NB vs PCX7447MGU733LB |
| PC7447VGU733LB | RISC Microprocessor, 32-Bit, 733MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | MC7447AHX733NB vs PC7447VGU733LB |