Findchips: Compare PC7447VGU733LB vs MC7447AVU733NB

PC7447VGU733LB vs MC7447AVU733NB feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	ATMEL CORP	FREESCALE SEMICONDUCTOR INC
Part Package Code	BGA	BGA
Package Description	BGA,	BGA, BGA360,19X19,50
Pin Count	360	360
Reach Compliance Code	unknown	not_compliant
ECCN Code	3A991.A.2	3A991.A.1
HTS Code	8542.31.00.01	8542.31.00.01
Additional Feature	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width	36	36
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	167 MHz	167 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-CBGA-B360	S-CBGA-B360
Length	25 mm	25 mm
Low Power Mode	YES	YES
Number of Terminals	360	360
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.2 mm	2.8 mm
Speed	733 MHz	733 MHz
Supply Voltage-Max	1.35 V	1.35 V
Supply Voltage-Min	1.25 V	1.25 V
Supply Voltage-Nom	1.3 V	1.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	2	3
Pbfree Code		No
Rohs Code		Yes
JESD-609 Code		e2
Moisture Sensitivity Level		1
Package Equivalence Code		BGA360,19X19,50
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		40
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors