MC68SZ328VH66V
vs
GD80960JT100
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
INTEL CORP
Part Package Code
BGA
BGA
Package Description
12 X 12 MM, 0.80 MM PITCH, MAPBGA-196
BGA, BGA196(UNSPEC)
Pin Count
196
196
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
25
32
Boundary Scan
NO
YES
Clock Frequency-Max
16 MHz
33.3 MHz
External Data Bus Width
16
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Length
12 mm
Low Power Mode
YES
YES
Number of Terminals
196
196
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.36 mm
Speed
66.32 MHz
100 MHz
Supply Voltage-Max
3.3 V
3.45 V
Supply Voltage-Min
2.7 V
3.15 V
Supply Voltage-Nom
3 V
3.3 V
Surface Mount
YES
YES
Technology
HCMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
12 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
3
1
Rohs Code
ECCN Code
3A991.A.2
Bit Size
32
Moisture Sensitivity Level
1
Package Equivalence Code
BGA196(UNSPEC)
Supply Current-Max
600 mA
Compare MC68SZ328VH66V with alternatives
Compare GD80960JT100 with alternatives