MC68SZ328VH66V vs MCF5274LCVM166 feature comparison

MC68SZ328VH66V Freescale Semiconductor

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MCF5274LCVM166 Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 12 X 12 MM, 0.80 MM PITCH, MAPBGA-196 ROHS COMPLIANT, MAPBGA-196
Pin Count 196 196
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 25 24
Boundary Scan NO YES
Clock Frequency-Max 16 MHz 83 MHz
External Data Bus Width 16 32
Format FIXED POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
Length 12 mm 15 mm
Low Power Mode YES YES
Number of Terminals 196 196
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.36 mm 1.6 mm
Speed 66.32 MHz 166 MHz
Supply Voltage-Max 3.3 V 1.6 V
Supply Voltage-Min 2.7 V 1.4 V
Supply Voltage-Nom 3 V 1.5 V
Surface Mount YES YES
Technology HCMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 12 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 3 2
Pbfree Code Yes
Rohs Code Yes
ECCN Code 5A992
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Bit Size 32
Moisture Sensitivity Level 3
Package Equivalence Code BGA196,14X14,40
Peak Reflow Temperature (Cel) 260
Supply Current-Max 175 mA
Terminal Finish TIN SILVER COPPER OVER NICKEL
Time@Peak Reflow Temperature-Max (s) 40

Compare MC68SZ328VH66V with alternatives

Compare MCF5274LCVM166 with alternatives