MB7137HCF
vs
5962-887350023C
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU LTD
|
WAFERSCALE INTEGRATION INC
|
| Package Description |
DFP, FL24,.4
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
70 ns
|
|
| JESD-30 Code |
R-XDFP-F24
|
|
| JESD-609 Code |
e0
|
|
| Memory Density |
4194304 bit
|
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
24
|
|
| Number of Words |
2048 words
|
|
| Number of Words Code |
256000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
256KX16
|
|
| Package Body Material |
CERAMIC
|
|
| Package Code |
DFP
|
|
| Package Equivalence Code |
FL24,.4
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.07 mA
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
TTL
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
FLAT
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MB7137HCF with alternatives
Compare 5962-887350023C with alternatives