MB7137HCF
vs
HC6616/1KCHZC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FUJITSU LTD
|
HONEYWELL MICROELECTRONICS AND PRECISION SENSORS
|
Package Description |
DFP, FL24,.4
|
DFP,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
70 ns
|
110 ns
|
JESD-30 Code |
R-XDFP-F24
|
R-CDFP-F24
|
JESD-609 Code |
e0
|
|
Memory Density |
4194304 bit
|
16384 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
16
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Number of Words |
2048 words
|
2048 words
|
Number of Words Code |
256000
|
2000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
256KX16
|
2KX8
|
Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DFP
|
DFP
|
Package Equivalence Code |
FL24,.4
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
0.07 mA
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
TTL
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
DFP
|
Pin Count |
|
24
|
Additional Feature |
|
RADIATION-HARDENED ROM
|
Length |
|
15.1384 mm
|
Seated Height-Max |
|
3.175 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Width |
|
10.16 mm
|
|
|
|
Compare MB7137HCF with alternatives
Compare HC6616/1KCHZC with alternatives