MAX14595ETA+
vs
NVT2002DP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Part Package Code |
8-LFCSP-2X2X0.75
|
SOIC
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
8-LFCSP-2X2X0.75
|
|
Date Of Intro |
2012-01-19
|
|
Samacsys Manufacturer |
Analog Devices
|
NXP
|
Interface IC Type |
INTERFACE CIRCUIT
|
|
JESD-30 Code |
S-PDSO-N8
|
|
JESD-609 Code |
e4
|
|
Length |
2 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
|
Number of Terminals |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
VSON
|
|
Package Shape |
SQUARE
|
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
0.8 mm
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
0.9 V
|
|
Supply Voltage-Nom |
1.2 V
|
|
Supply Voltage1-Max |
5.5 V
|
|
Supply Voltage1-Min |
1.65 V
|
|
Supply Voltage1-Nom |
3 V
|
|
Surface Mount |
YES
|
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
2 mm
|
|
Base Number Matches |
1
|
1
|
Ihs Manufacturer |
|
NXP SEMICONDUCTORS
|
Package Description |
|
TSSOP,
|
Reach Compliance Code |
|
compliant
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX14595ETA+ with alternatives
Compare NVT2002DP with alternatives