M87C257-20XC1 vs HY234100G-200 feature comparison

M87C257-20XC1 STMicroelectronics

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HY234100G-200 SK Hynix Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS SK HYNIX INC
Part Package Code QFJ SOIC
Package Description QCCJ, LDCC32,.5X.6 SOP, SOP40,.56
Pin Count 32 40
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 200 ns
I/O Type COMMON
JESD-30 Code R-PQCC-J32 R-PDSO-G40
JESD-609 Code e3 e0
Length 13.97 mm 18.517 mm
Memory Density 262144 bit 4194304 bit
Memory IC Type OTP ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 40
Number of Words 32768 words 524288 words
Number of Words Code 32000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 512KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ SOP
Package Equivalence Code LDCC32,.5X.6 SOP40,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.56 mm
Standby Current-Max 0.0001 A 0.00005 A
Supply Current-Max 0.03 mA 0.04 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD DUAL
Width 11.43 mm 11.24 mm
Base Number Matches 4 1
Pbfree Code No
Alternate Memory Width 16

Compare M87C257-20XC1 with alternatives

Compare HY234100G-200 with alternatives