There are no models available for this part yet.
Overview of M87C257-20XC1 by STMicroelectronics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
CAD Models for M87C257-20XC1 by STMicroelectronics
Part Data Attributes for M87C257-20XC1 by STMicroelectronics
|
|
|
|---|---|
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Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
STMICROELECTRONICS
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|
Part Package Code
|
QFJ
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|
Package Description
|
QCCJ, LDCC32,.5X.6
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Pin Count
|
32
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|
Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.71
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|
Access Time-Max
|
150 ns
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|
I/O Type
|
COMMON
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JESD-30 Code
|
R-PQCC-J32
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|
JESD-609 Code
|
e3
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Length
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13.97 mm
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Memory Density
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262144 bit
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Memory IC Type
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OTP ROM
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
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32
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Number of Words
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32768 words
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Number of Words Code
|
32000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
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Organization
|
32KX8
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
|
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Package Code
|
QCCJ
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Package Equivalence Code
|
LDCC32,.5X.6
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Package Shape
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RECTANGULAR
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Package Style
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CHIP CARRIER
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Parallel/Serial
|
PARALLEL
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Qualification Status
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Not Qualified
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Seated Height-Max
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3.56 mm
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Standby Current-Max
|
0.0001 A
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Supply Current-Max
|
0.03 mA
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Supply Voltage-Max (Vsup)
|
5.25 V
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Supply Voltage-Min (Vsup)
|
4.75 V
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|
Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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MATTE TIN
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|
Terminal Form
|
J BEND
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Terminal Pitch
|
1.27 mm
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Terminal Position
|
QUAD
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Width
|
11.43 mm
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Alternate Parts for M87C257-20XC1
This table gives cross-reference parts and alternative options found for M87C257-20XC1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M87C257-20XC1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT27LV256R-30JI | Memory IC | Microchip Technology Inc | M87C257-20XC1 vs AT27LV256R-30JI |
| AS29LL008-200TC | Flash, 1MX8, 200ns, PDSO40, 10 X 20 MM, TSOP1-40 | Alliance Semiconductor Corporation | M87C257-20XC1 vs AS29LL008-200TC |
| 5962-9669201HUC | Flash Module, 512KX8, 150ns, CDMA32, UNFORMED, FP-32 | Cobham Power Products | M87C257-20XC1 vs 5962-9669201HUC |
| HY234100G-200 | MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40 | SK Hynix Inc | M87C257-20XC1 vs HY234100G-200 |
| AM28F010-150C3PC | Flash, 128KX8, 150ns, PDIP32, PLASTIC, DIP-32 | Rochester Electronics LLC | M87C257-20XC1 vs AM28F010-150C3PC |
| M27V401-250L1 | 512KX8 UVPROM, 250ns, CQCC32, 2.80 MM HEIGHT, WINDOWED, CERAMIC, LCC-32 | STMicroelectronics | M87C257-20XC1 vs M27V401-250L1 |
| M27V512-200B1 | 64KX8 OTPROM, 200ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | STMicroelectronics | M87C257-20XC1 vs M27V512-200B1 |
| M27V101-250L6 | 128KX8 UVPROM, 250ns, CQCC32, 2.80 MM HEIGHT, WINDOWED, CERAMIC, LCC-32 | STMicroelectronics | M87C257-20XC1 vs M27V101-250L6 |
| AT27C512-25JC | Memory IC | Microchip Technology Inc | M87C257-20XC1 vs AT27C512-25JC |
| LRS1338A | Flash, 512KX16, 120ns, PDSO48, 10 X 14 MM, PLASTIC, TSOP-48 | Sharp Corp | M87C257-20XC1 vs LRS1338A |