M87C257-20XC1 vs M27V512-200B1 feature comparison

M87C257-20XC1 STMicroelectronics

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M27V512-200B1 STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code QFJ DIP
Package Description QCCJ, LDCC32,.5X.6 DIP, DIP28,.6
Pin Count 32 28
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 200 ns
I/O Type COMMON COMMON
JESD-30 Code R-PQCC-J32 R-PDIP-T28
JESD-609 Code e3 e0
Length 13.97 mm 37.085 mm
Memory Density 262144 bit 524288 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 32768 words 65536 words
Number of Words Code 32000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 64KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC32,.5X.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.56 mm 5.08 mm
Standby Current-Max 0.0001 A 0.00001 A
Supply Current-Max 0.03 mA 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Base Number Matches 1 1

Compare M87C257-20XC1 with alternatives

Compare M27V512-200B1 with alternatives