Findchips: Compare M38510H05051BCA vs 933277590652

M38510H05051BCA vs 933277590652 feature comparison

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Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	HARRIS SEMICONDUCTOR	NXP SEMICONDUCTORS
Part Package Code	DIP	DIP
Package Description	DIP,	DIP,
Pin Count	14	14
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	4000/14000/40000	4000/14000/40000
JESD-30 Code	R-GDIP-T14	R-PDIP-T14
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C
Operating Temperature-Min	-55 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Propagation Delay (tpd)	300 ns	110 ns
Qualification Status	Not Qualified	Not Qualified
Screening Level	MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)	15 V	15 V
Supply Voltage-Min (Vsup)	4.5 V	3 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Position	DUAL	DUAL
Total Dose	1M Rad(Si) V
Base Number Matches	2	1
Pbfree Code		Yes
Rohs Code		Yes
JESD-609 Code		e4
Length		19.025 mm
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Seated Height-Max		4.2 mm
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		2.54 mm
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
Width		7.62 mm
	Logic » Gates	Logic » Gates