933277590652 vs HEF4011UBP,652 feature comparison

933277590652 NXP Semiconductors

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HEF4011UBP,652 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4 e4
Length 19.025 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 110 ns 120 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.2 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Manufacturer Package Code SOT27-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.00035999999999999997 A
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 120 ns
Schmitt Trigger NO
Temperature Grade INDUSTRIAL

Compare 933277590652 with alternatives

Compare HEF4011UBP,652 with alternatives