M38510H05051BCA
vs
MM74C00N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
HARRIS SEMICONDUCTOR
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
CMOS
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
300 ns
90 ns
Qualification Status
Not Qualified
COMMERCIAL
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
Base Number Matches
2
4
Pbfree Code
Rohs Code
JESD-609 Code
e3
Length
19.18 mm
Moisture Sensitivity Level
NOT APPLICABLE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Seated Height-Max
5.08 mm
Terminal Finish
MATTE TIN
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
7.62 mm
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