933277590652 vs MM74C00N feature comparison

933277590652 NXP Semiconductors

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MM74C00N Rochester Electronics LLC

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000 CMOS
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4 e3
Length 19.025 mm 19.18 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT APPLICABLE
Propagation Delay (tpd) 110 ns 90 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT APPLICABLE
Width 7.62 mm 7.62 mm
Base Number Matches 1 4
Moisture Sensitivity Level NOT APPLICABLE
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Temperature Grade MILITARY

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