M36L0T7050B0ZAQF vs MT28C256564W18SFT-F706P70BBWT feature comparison

M36L0T7050B0ZAQF STMicroelectronics

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MT28C256564W18SFT-F706P70BBWT Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 LFBGA,
Pin Count 88 88
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns
Additional Feature PSRAM IS ORGANIZED AS 2M X 16 CELLULARRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e1 e1
Length 10 mm 12 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA88,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 9 mm
Base Number Matches 3 1

Compare M36L0T7050B0ZAQF with alternatives

Compare MT28C256564W18SFT-F706P70BBWT with alternatives