M36L0T7050B0ZAQF
vs
M36L0T7050B0ZAQT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88
TFBGA,
Pin Count
88
88
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
90 ns
Additional Feature
PSRAM IS ORGANIZED AS 2M X 16
PSRAM IS ORGANIZED AS 2M X 16
JESD-30 Code
R-PBGA-B88
R-PBGA-B88
JESD-609 Code
e1
e0
Length
10 mm
10 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM
Number of Functions
1
1
Number of Terminals
88
88
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Organization
8MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA88,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.000005 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
3
3
Pbfree Code
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