M36L0T7050B0ZAQF vs M36W0R6050L4ZAMF feature comparison

M36L0T7050B0ZAQF Micron Technology Inc

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M36W0R6050L4ZAMF Micron Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA, BGA88,8X12,32
Pin Count 88 88
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSRAM IS ORGANIZED AS 2M X 16 IT ALSO HAVING 32-MBIT PSRAM
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e1 e1
Length 10 mm 10 mm
Memory Density 134217728 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 8388608 words 4194304 words
Number of Words Code 8000000 4000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -30 °C
Organization 8MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 3 2
Access Time-Max 70 ns
Mixed Memory Type FLASH+PSRAM
Package Equivalence Code BGA88,8X12,32
Supply Voltage-Nom (Vsup) 1.8 V

Compare M36L0T7050B0ZAQF with alternatives

Compare M36W0R6050L4ZAMF with alternatives