Findchips: Compare M1A3P600L-FGG256YI vs M1A3P600L-1FG256YI

M1A3P600L-FGG256YI vs M1A3P600L-1FG256YI feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	MICROCHIP TECHNOLOGY INC	MICROSEMI SOC PRODUCTS GROUP
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	250 MHz	250 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
JESD-609 Code	e1	e0
Length	17 mm
Moisture Sensitivity Level	3	3
Number of CLBs	13824
Number of Equivalent Gates	600000
Number of Inputs	177	177
Number of Logic Cells	13824	13824
Number of Outputs	177	177
Number of Terminals	256	256
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	13824 CLBS, 600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.14 V
Supply Voltage-Nom	1.2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	17 mm
Base Number Matches	3	3
Package Description		BGA, BGA256,16X16,40
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays