M1A3P600L-1FG256YI
vs
M1A3P600L-FG256Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
BGA, BGA256,16X16,40
BGA, BGA256,16X16,40
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
250 MHz
250 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Moisture Sensitivity Level
3
3
Number of Inputs
177
177
Number of Logic Cells
13824
13824
Number of Outputs
177
177
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
3
3
Compare M1A3P600L-1FG256YI with alternatives
Compare M1A3P600L-FG256Y with alternatives