Findchips: Compare M1A3P600L-FGG256YI vs M1A3P600L-FG256Y

M1A3P600L-FGG256YI vs M1A3P600L-FG256Y feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI SOC PRODUCTS GROUP	MICROSEMI SOC PRODUCTS GROUP
Package Description	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	250 MHz	250 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
JESD-609 Code	e1	e0
Moisture Sensitivity Level	3	3
Number of Inputs	177	177
Number of Logic Cells	13824	13824
Number of Outputs	177	177
Number of Terminals	256	256
Operating Temperature-Max	85 °C	70 °C
Operating Temperature-Min	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	COMMERCIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Base Number Matches	3	3
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays