LH53B8P00BD vs KM23C8100B-12 feature comparison

LH53B8P00BD Sharp Corp

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KM23C8100B-12 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SHARP CORP SAMSUNG SEMICONDUCTOR INC
Package Description DIP-42 DIP, DIP42,.6
Reach Compliance Code unknown unknown
Access Time-Max 120 ns 120 ns
Additional Feature CONFIGURABLE AS 512K X 16
JESD-30 Code R-PDIP-T42 R-PDIP-T42
Length 53.8 mm 52.43 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 1048576 words 524288 words
Number of Words Code 1000000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 1MX8 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.4 mm 5.08 mm
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 42
ECCN Code EAR99
HTS Code 8542.32.00.71
Alternate Memory Width 8
JESD-609 Code e0
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE
Package Equivalence Code DIP42,.6
Standby Current-Max 0.00005 A
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD

Compare LH53B8P00BD with alternatives

Compare KM23C8100B-12 with alternatives