LH53B8P00BD vs UPD23C8000XCZ-XXX feature comparison

LH53B8P00BD Sharp Corp

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UPD23C8000XCZ-XXX Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SHARP CORP RENESAS ELECTRONICS CORP
Package Description DIP-42
Reach Compliance Code unknown unknown
Access Time-Max 120 ns 120 ns
Additional Feature CONFIGURABLE AS 512K X 16
JESD-30 Code R-PDIP-T42 R-PDIP-T42
Length 53.8 mm
Memory Density 8388608 bit 33554432 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 1048576 words 524288 words
Number of Words Code 1000000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 1MX8 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.4 mm
Supply Current-Max 0.05 mA 0.07 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 2
Rohs Code No
ECCN Code EAR99
HTS Code 8542.32.00.71
Alternate Memory Width 8
JESD-609 Code e0
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code DIP42,.6
Standby Current-Max 0.0001 A
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)

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