LF48410GMB39
vs
LF48410GMB30
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LOGIC DEVICES INC
|
LOGIC DEVICES INC
|
| Part Package Code |
PGA
|
PGA
|
| Package Description |
PGA,
|
PGA,
|
| Pin Count |
84
|
84
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ICC SPECIFIED @ 20MHZ
|
ICC SPECIFIED @ 20MHZ
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
25.6 MHz
|
33.3 MHz
|
| External Data Bus Width |
24
|
24
|
| JESD-30 Code |
S-CPGA-P84
|
S-CPGA-P84
|
| JESD-609 Code |
e0
|
e0
|
| Length |
29.464 mm
|
29.464 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
84
|
84
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Data Bus Width |
24
|
24
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883
|
| Seated Height-Max |
4.445 mm
|
4.445 mm
|
| Supply Current-Max |
310 mA
|
310 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
29.464 mm
|
29.464 mm
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, HISTOGRAM PROCESSOR
|
DSP PERIPHERAL, HISTOGRAM PROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LF48410GMB39 with alternatives
Compare LF48410GMB30 with alternatives