KSZ8895RLXITR
vs
KSZ9563RNXC-TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
LFQFP,
HVQCCN,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2016-08-12
2018-02-16
JESD-30 Code
S-PQFP-G128
S-PQCC-N64
Length
14 mm
8 mm
Number of Functions
1
1
Number of Terminals
128
64
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
HVQCCN
Package Equivalence Code
QFP128,.63SQ,16
LCC64,.32SQ,16
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level
TS 16949
Seated Height-Max
1.6 mm
0.9 mm
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Telecom IC Type
ETHERNET SWITCH
ETHERNET SWITCH
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
QUAD
QUAD
Width
14 mm
8 mm
Base Number Matches
1
1
ECCN Code
EAR99
Factory Lead Time
7 Weeks
Samacsys Manufacturer
Microchip
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare KSZ8895RLXITR with alternatives
Compare KSZ9563RNXC-TR with alternatives