K9F2808U0A-YIB0
vs
HY23V28100S
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SK HYNIX INC
Part Package Code
TSOP1
SOIC
Package Description
12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
SOP,
Pin Count
48
44
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Access Time-Max
35 ns
150 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G44
Length
18.4 mm
28.275 mm
Memory Density
134217728 bit
16777216 bit
Memory IC Type
FLASH
MASK ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
48
44
Number of Words
16777216 words
8388608 words
Number of Words Code
16000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
16MX8
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
3.1 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
SLC NAND TYPE
Width
12 mm
12.6 mm
Base Number Matches
1
1
Supply Current-Max
0.025 mA
Compare K9F2808U0A-YIB0 with alternatives
Compare HY23V28100S with alternatives