HY23V28100S
vs
K3P9V4000A-GC12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP44,.63
Pin Count
44
44
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
120 ns
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
Length
28.275 mm
28.5 mm
Memory Density
16777216 bit
134217728 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.1 mm
3.1 mm
Supply Current-Max
0.025 mA
0.08 mA
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
12.6 mm
12.6 mm
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
SOP44,.63
Standby Current-Max
0.00003 A
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Terminal Finish
TIN LEAD
Compare HY23V28100S with alternatives
Compare K3P9V4000A-GC12 with alternatives