K9F2808U0A-YIB0
vs
NAND128W3A0BN6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
STMICROELECTRONICS
Part Package Code
TSOP1
TSOP
Package Description
12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
12 X 20 MM, PLASTIC, TSOP-48
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
18.4 mm
18.4 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX8
16MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
SLC NAND TYPE
SLC NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare K9F2808U0A-YIB0 with alternatives
Compare NAND128W3A0BN6 with alternatives