K7M403225B-QI650 vs MT58LC128K32D9BG-8.5 feature comparison

K7M403225B-QI650 Samsung Semiconductor

Buy Now Datasheet

MT58LC128K32D9BG-8.5 Micron Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Part Package Code QFP BGA
Package Description LQFP, 14 X 22 MM, BGA-119
Pin Count 100 119
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6.5 ns 4.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE AUTOMATIC POWER DOWN
JESD-30 Code R-PQFP-G100 R-PBGA-B119
Length 20 mm 22 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX32 128KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 117 MHz
I/O Type COMMON
JESD-609 Code e0
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.275 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare K7M403225B-QI650 with alternatives

Compare MT58LC128K32D9BG-8.5 with alternatives