MT58LC128K32D9BG-8.5
vs
W25P025AD-7F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Part Package Code
BGA
QFP
Package Description
14 X 22 MM, BGA-119
LQFP,
Pin Count
119
100
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.5 ns
7 ns
Additional Feature
AUTOMATIC POWER DOWN
Clock Frequency-Max (fCLK)
117 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PQFP-G100
JESD-609 Code
e0
Length
22 mm
20 mm
Memory Density
4194304 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
Number of Terminals
119
100
Number of Words
131072 words
65536 words
Number of Words Code
128000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Organization
128KX32
64KX32
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LQFP
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
1.6 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.275 mA
Supply Voltage-Max (Vsup)
3.6 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
14 mm
14 mm
Base Number Matches
1
1
Compare MT58LC128K32D9BG-8.5 with alternatives
Compare W25P025AD-7F with alternatives