MT58LC128K32D9BG-8.5
vs
MT58LC64K32C4LG-6LTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
QFP
Package Description
14 X 22 MM, BGA-119
LQFP,
Pin Count
119
100
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.5 ns
Additional Feature
AUTOMATIC POWER DOWN
Clock Frequency-Max (fCLK)
117 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PQFP-G100
JESD-609 Code
e0
e0
Length
22 mm
20 mm
Memory Density
4194304 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
119
100
Number of Words
131072 words
65536 words
Number of Words Code
128000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX32
64KX32
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LQFP
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
1.6 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
2 V
Supply Current-Max
0.275 mA
Supply Voltage-Max (Vsup)
3.6 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
14 mm
14 mm
Base Number Matches
1
1
Compare MT58LC128K32D9BG-8.5 with alternatives
Compare MT58LC64K32C4LG-6LTR with alternatives