K7M163645A-FC200 vs GS841E18AI-133I feature comparison

K7M163645A-FC200 Samsung Semiconductor

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GS841E18AI-133I GSI Technology

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, BGA,
Pin Count 165 119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e0 e0
Length 15 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type ZBT SRAM CACHE TAG SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX36 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.99 mm
Supply Voltage-Max (Vsup) 3.465 V 3.63 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Access Time-Max 11 ns
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220

Compare K7M163645A-FC200 with alternatives

Compare GS841E18AI-133I with alternatives