GS841E18AI-133I vs R1Q3A3636ABG-33R feature comparison

GS841E18AI-133I GSI Technology

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R1Q3A3636ABG-33R Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY RENESAS TECHNOLOGY CORP
Part Package Code BGA BGA
Package Description BGA, 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165
Pin Count 119 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 11 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B165
JESD-609 Code e0 e1
Length 22 mm 17 mm
Memory Density 4718592 bit 37748736 bit
Memory IC Type CACHE TAG SRAM QDR SRAM
Memory Width 18 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 262144 words 1048576 words
Number of Words Code 256000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX18 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL SERIAL
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.99 mm 1.46 mm
Supply Voltage-Max (Vsup) 3.63 V 1.9 V
Supply Voltage-Min (Vsup) 3.135 V 1.7 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 15 mm
Base Number Matches 1 1

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Compare R1Q3A3636ABG-33R with alternatives