Part Details for K7M163645A-FC200 by Samsung Semiconductor
Overview of K7M163645A-FC200 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Industrial Automation
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Renewable Energy
Automotive
Robotics and Drones
Part Details for K7M163645A-FC200
K7M163645A-FC200 CAD Models
K7M163645A-FC200 Part Data Attributes
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K7M163645A-FC200
Samsung Semiconductor
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Datasheet
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K7M163645A-FC200
Samsung Semiconductor
ZBT SRAM, 512KX36, CMOS, PBGA165, FBGA-165
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for K7M163645A-FC200
This table gives cross-reference parts and alternative options found for K7M163645A-FC200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7M163645A-FC200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS8161E36DD-150 | Cache SRAM, 512KX36, 7.5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | K7M163645A-FC200 vs GS8161E36DD-150 |
GS8161E36DGT-333V | Cache SRAM, 512KX36, 5ns, CMOS, PQFP100, TQFP-100 | GSI Technology | K7M163645A-FC200 vs GS8161E36DGT-333V |
R1Q3A3618ABG-60R | IC,SYNC SRAM,QDR,2MX18,CMOS,BGA,165PIN,PLASTIC | Renesas Electronics Corporation | K7M163645A-FC200 vs R1Q3A3618ABG-60R |
IS61VF51236A-7.5TQVI | 512KX36 CACHE SRAM, 7.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-100 | Integrated Silicon Solution Inc | K7M163645A-FC200 vs IS61VF51236A-7.5TQVI |
CY7C1163KV18-550BZC | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | K7M163645A-FC200 vs CY7C1163KV18-550BZC |
GS8182D37BD-435MT | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | K7M163645A-FC200 vs GS8182D37BD-435MT |
GS8162Z18DD-250IT | ZBT SRAM, 1MX18, 5.5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | K7M163645A-FC200 vs GS8162Z18DD-250IT |
K7M161845A-FC160 | ZBT SRAM, 1MX18, CMOS, PBGA165, FBGA-165 | Samsung Semiconductor | K7M163645A-FC200 vs K7M161845A-FC160 |
CY7C1314KV18-300BZXC | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7M163645A-FC200 vs CY7C1314KV18-300BZXC |
K7B163625M-QC900 | Cache SRAM, 512KX36, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Samsung Semiconductor | K7M163645A-FC200 vs K7B163625M-QC900 |