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K4C89183AF-GIG70 vs K4C89183AF-GIFB0 feature comparison

K4C89183AF-GIG70 Samsung Semiconductor

Buy Now Datasheet

K4C89183AF-GIFB0 Samsung Semiconductor

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 60 60
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.5 ns 0.5 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
JESD-609 Code e0 e0
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 16MX18 16MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Memory » DRAMs
Memory » DRAMs

Compare K4C89183AF-GIG70 with alternatives

Compare K4C89183AF-GIFB0 with alternatives