JM38510/30009SDX vs HD74LS27FPEL feature comparison

JM38510/30009SDX Motorola Semiconductor Products

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HD74LS27FPEL Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC RENESAS ELECTRONICS CORP
Package Description DFP, SOP, SOP14,.3
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDFP-F14 R-PDSO-G14
Length 9.21 mm 10.06 mm
Logic IC Type NAND GATE NOR GATE
Number of Functions 1 3
Number of Inputs 8 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C -20 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 20 ns 15 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class S
Seated Height-Max 2.03 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 6.285 mm 5.5 mm
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
Load Capacitance (CL) 15 pF
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Packing Method TR
Power Supply Current-Max (ICC) 6.8 mA
Prop. Delay@Nom-Sup 15 ns
Schmitt Trigger NO

Compare JM38510/30009SDX with alternatives

Compare HD74LS27FPEL with alternatives