ISD5108EYI vs ISD33120SI feature comparison

ISD5108EYI Nuvoton Technology Corp

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ISD33120SI Winbond Electronics Corp

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Package Description TSSOP, TSSOP28,.53,22 0.300 INCH, PLASTIC, SOIC-28
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Number of Functions 1 1
Number of Terminals 28 28
On Chip Memory Type FLASH EEPROM
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP28,.53,22 SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 480 s 129.6 s
Supply Current-Max 40 mA 40 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.55 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code SOIC
Pin Count 28
JESD-609 Code e0
Length 17.9 mm
Seated Height-Max 2.65 mm
Terminal Finish TIN LEAD
Width 7.5 mm

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