ISD33120SI
vs
I17150PYI01
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INFORMATION STORAGE DEVICES
WINBOND ELECTRONICS CORP
Package Description
SOP, SOP28,.4
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDSO-G28
R-PDIP-T28
JESD-609 Code
e0
e3
Number of Functions
1
1
Number of Terminals
28
28
On Chip Memory Type
EEPROM
FLASH
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP28,.4
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
125.7 s
300 s
Supply Current-Max
40 mA
Supply Voltage-Max (Vsup)
3.3 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
2.4 V
Surface Mount
YES
NO
Technology
CMOS
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
28
Length
36.83 mm
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Seated Height-Max
4.83 mm
Temperature Grade
INDUSTRIAL
Width
15.24 mm
Compare ISD33120SI with alternatives
Compare I17150PYI01 with alternatives