ISD33120SI
vs
ISD4004-12MSYI
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
0.300 INCH, PLASTIC, SOIC-28
SOP, SOP28,.4
Pin Count
28
28
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDSO-G28
R-PDSO-G28
JESD-609 Code
e0
Length
17.9 mm
17.93 mm
Number of Functions
1
1
Number of Terminals
28
28
On Chip Memory Type
EEPROM
FLASH
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP28,.4
SOP28,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
129.6 s
720 s
Seated Height-Max
2.65 mm
2.64 mm
Supply Current-Max
40 mA
40 mA
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.52 mm
Base Number Matches
2
2
Compare ISD33120SI with alternatives
Compare ISD4004-12MSYI with alternatives