ISD4003-08MXD vs I17180XY01 feature comparison

ISD4003-08MXD Winbond Electronics Corp

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I17180XY01 Winbond Electronics Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code DIE DIE
Package Description DIE, DIE,
Pin Count 19
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-XUUC-N19 X-XUUC-N
Number of Functions 1 1
Number of Terminals 19
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 70 °C 50 °C
Operating Temperature-Min -20 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style UNCASED CHIP UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 480 s 360 s
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Base Number Matches 1 1

Compare ISD4003-08MXD with alternatives

Compare I17180XY01 with alternatives