ISD4003-08MXD vs ISD1212GI feature comparison

ISD4003-08MXD Winbond Electronics Corp

Buy Now Datasheet

ISD1212GI Winbond Electronics Corp

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code DIE SOIC
Package Description DIE, SOP,
Pin Count 19 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-XUUC-N19 R-PDSO-G28
Number of Functions 1
Number of Terminals 19 28
On Chip Memory Type FLASH
Operating Temperature-Max 70 °C
Operating Temperature-Min -20 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 480 s
Supply Voltage-Max (Vsup) 3.3 V
Supply Voltage-Min (Vsup) 2.7 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 2 2
Length 18.14 mm
Seated Height-Max 2.54 mm
Terminal Pitch 1.27 mm
Width 8.79 mm

Compare ISD4003-08MXD with alternatives

Compare ISD1212GI with alternatives