IS61LPS12836A-200B2I
vs
71V35761S200BGGI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SEIKO INSTRUMENTS USA INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
PBGA
Package Description
BGA,
BGA-119
Pin Count
119
119
Reach Compliance Code
unknown
unknown
Access Time-Max
3.1 ns
3.1 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
Length
22 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX36
128KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
3.5 mm
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
Base Number Matches
1
2
Pbfree Code
Yes
Rohs Code
Yes
Manufacturer Package Code
BGG119
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN SILVER COPPER
Compare IS61LPS12836A-200B2I with alternatives
Compare 71V35761S200BGGI with alternatives