IRFR2229A vs PHD9NQ20T,118 feature comparison

IRFR2229A Intersil Corporation

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PHD9NQ20T,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PSSO-G2 PLASTIC, SMD, SC-63, DPAK-3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
Configuration SINGLE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 200 V 200 V
Drain Current-Max (ID) 3.8 A 8.7 A
Drain-source On Resistance-Max 1.2 Ω 0.4 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-252AA
JESD-30 Code R-PSSO-G2 R-PSSO-G2
Number of Elements 1 1
Number of Terminals 2 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Rohs Code Yes
Part Package Code DPAK
Pin Count 3
Manufacturer Package Code SOT428
HTS Code 8541.29.00.75
Avalanche Energy Rating (Eas) 93 mJ
Case Connection DRAIN
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 175 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 88 W
Pulsed Drain Current-Max (IDM) 35 A
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING

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