ICS93V857YK-130T
vs
PI6CVF857NF
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
HVQCCN,
|
VFBGA-56
|
| Pin Count |
40
|
56
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
93V
|
6C
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
S-PQCC-N40
|
R-PBGA-B56
|
| JESD-609 Code |
e0
|
e0
|
| Length |
6 mm
|
7 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
40
|
56
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.06 ns
|
0.075 ns
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
6 mm
|
4.5 mm
|
| fmax-Min |
170 MHz
|
220 MHz
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| Max I(ol) |
|
0.012 A
|
| Package Equivalence Code |
|
BGA56,6X10,25
|
|
|
|
Compare ICS93V857YK-130T with alternatives
Compare PI6CVF857NF with alternatives