PI6CVF857NF
vs
MC100EP220TB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
VFBGA-56
|
HLQFP,
|
| Pin Count |
56
|
52
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
6C
|
100E
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PBGA-B56
|
S-PQFP-G52
|
| JESD-609 Code |
e0
|
|
| Length |
7 mm
|
10 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Max I(ol) |
0.012 A
|
|
| Number of Functions |
1
|
2
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
56
|
52
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HLQFP
|
| Package Equivalence Code |
BGA56,6X10,25
|
QFP52,.47SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.075 ns
|
0.06 ns
|
| Seated Height-Max |
0.8 mm
|
1.7 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
3.8 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.6 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
4.5 mm
|
10 mm
|
| fmax-Min |
220 MHz
|
|
| Base Number Matches |
1
|
4
|
| Additional Feature |
|
ECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V
|
| Propagation Delay (tpd) |
|
0.55 ns
|
| Technology |
|
ECL
|
|
|
|
Compare PI6CVF857NF with alternatives
Compare MC100EP220TB with alternatives