ICS93V857YK-130T
vs
TS88915TVWB/T70
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
QFN
|
QLCC
|
| Package Description |
HVQCCN,
|
CERAMIC, LCC-28
|
| Pin Count |
40
|
28
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
93V
|
88915
|
| Input Conditioning |
DIFFERENTIAL
|
MUX
|
| JESD-30 Code |
S-PQCC-N40
|
S-CQCC-J28
|
| JESD-609 Code |
e0
|
|
| Length |
6 mm
|
11.43 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
1
|
| Number of Terminals |
40
|
28
|
| Number of True Outputs |
10
|
7
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
HVQCCN
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.06 ns
|
0.75 ns
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
6 mm
|
11.43 mm
|
| fmax-Min |
170 MHz
|
70 MHz
|
| Base Number Matches |
1
|
3
|
| Package Equivalence Code |
|
LDCC28,.5SQ
|
| Screening Level |
|
MIL-STD-883
|
| Technology |
|
CMOS
|
|
|
|
Compare ICS93V857YK-130T with alternatives
Compare TS88915TVWB/T70 with alternatives