IBM25PPC750CXEFP10-3T
vs
MPC850ZT50
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
Ihs Manufacturer |
IBM MICROELECTRONICS
|
MOTOROLA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
HLBGA,
|
BGA,
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
|
Bit Size |
64
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
133 MHz
|
|
External Data Bus Width |
64
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B256
|
R-PBGA-B256
|
Length |
24.13 mm
|
|
Low Power Mode |
YES
|
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
105 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HLBGA
|
BGA
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.539 mm
|
|
Speed |
600 MHz
|
|
Supply Voltage-Max |
1.9 V
|
|
Supply Voltage-Min |
1.7 V
|
|
Supply Voltage-Nom |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
24.13 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
2
|
Additional Feature |
|
SUPPORTS MULTIPLE PROTOCOLS
|
Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare IBM25PPC750CXEFP10-3T with alternatives
Compare MPC850ZT50 with alternatives