MPC850ZT50
vs
XPC823CZT25
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
256
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
SUPPORTS MULTIPLE PROTOCOLS
|
|
JESD-30 Code |
R-PBGA-B256
|
S-PBGA-B256
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-45 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
2
|
Address Bus Width |
|
26
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
25 MHz
|
External Data Bus Width |
|
32
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
Length |
|
23 mm
|
Low Power Mode |
|
YES
|
Seated Height-Max |
|
2.35 mm
|
Supply Voltage-Max |
|
3.6 V
|
Supply Voltage-Min |
|
3 V
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
23 mm
|
|
|
|
Compare MPC850ZT50 with alternatives
Compare XPC823CZT25 with alternatives