IBM25PPC750CXEFP10-3T
vs
MPC850ZT33
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
HLBGA,
BGA,
Pin Count
256
256
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
64
Boundary Scan
YES
Clock Frequency-Max
133 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B256
R-PBGA-B256
Length
24.13 mm
Low Power Mode
YES
Number of Terminals
256
256
Operating Temperature-Max
105 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HLBGA
BGA
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.539 mm
Speed
600 MHz
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
24.13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Additional Feature
SUPPORTS MULTIPLE PROTOCOLS
Temperature Grade
COMMERCIAL
Compare IBM25PPC750CXEFP10-3T with alternatives
Compare MPC850ZT33 with alternatives