HVB14S
vs
BAP65-05W,115
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NXP SEMICONDUCTORS
Package Description
CMPAK-3
PLASTIC, SC-70, 3 PIN
Pin Count
3
3
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00
Application
ATTENUATOR
ATTENUATOR; SWITCHING
Breakdown Voltage-Min
50 V
30 V
Configuration
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
COMMON CATHODE, 2 ELEMENTS
Diode Capacitance-Nom
0.25 pF
0.7 pF
Diode Element Material
SILICON
SILICON
Diode Forward Resistance-Max
7 Ω
0.9 Ω
Diode Res Test Current
10 mA
0.5 mA
Diode Res Test Frequency
100 MHz
100 MHz
Diode Type
PIN DIODE
PIN DIODE
Frequency Band
HIGH FREQUENCY
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
2
2
Number of Terminals
3
3
Operating Temperature-Max
125 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Power Dissipation-Max
0.1 W
0.24 W
Qualification Status
Not Qualified
Not Qualified
Reverse Test Voltage
50 V
Surface Mount
YES
YES
Technology
POSITIVE-INTRINSIC-NEGATIVE
POSITIVE-INTRINSIC-NEGATIVE
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Rohs Code
Part Package Code
SC-70
Manufacturer Package Code
SOT323
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Diode Capacitance-Max
0.9 pF
JESD-609 Code
e3
Minority Carrier Lifetime-Nom
0.17 µs
Moisture Sensitivity Level
1
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
Compare HVB14S with alternatives
Compare BAP65-05W,115 with alternatives