HM66AEB36104BP-30
vs
CY7C1305BV18-133BZC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LBGA, BGA165,11X15,40
13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
Pin Count
165
165
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
3 ns
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
17 mm
15 mm
Memory Density
37748736 bit
18874368 bit
Memory IC Type
DDR SRAM
QDR SRAM
Memory Width
36
18
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX36
1MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.46 mm
1.4 mm
Standby Current-Max
0.35 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.88 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
13 mm
Base Number Matches
1
1
Pbfree Code
Additional Feature
PIPELINED ARCHITECTURE
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
220
Terminal Finish
TIN LEAD
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Compare CY7C1305BV18-133BZC with alternatives